This FAQ will look at how a PC board loaded with anywhere from just a few to hundreds of components is soldered in one smooth process, and the fascinating technology and systems it takes to do that.

Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied primarily on manual component insertion and wave soldering has transformed ...

Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the ...

In our last installment of Tools of the Trade, we had just finished doing the inspection of the surface mount part of the PCB. Next in the process is the through hole components. Depending on the PCB, ...

Sasinno Americas is set to exhibit its latest advancements at Booth 4027 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. The company will ...

Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk. Indium ...