Laser Redefined, Metrology Reimagined, Data Revisualized

Nanoverse Technologies Limited (NVT) announces the release of its new Advanced Packaging line of tools. NVT has recently ...
Morningstar

Covalent Metrology Rebrands as Covalent to Reflect Expanded Capabilities and Focus on Material Insights

SUNNYVALE, Calif., Jan. 14, 2026 /PRNewswire/ -- Covalent Metrology today announced it has rebranded as Covalent and launched a new website reflecting a broader scope of products and services. The new ...

Siemens acquires Canopus AI to bring AI-based metrology to semiconductor manufacturing

Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, ...

ChackTok Unveils Metrology-Grade Full Body 3D Scanner, Revolutionizing 3D Printing for Event and Retail Businesses

With 0.01 mm accuracy and 20-second scanning, ChackTok helps photo booth and event businesses turn experiences into ...
EurekAlert!

Ultrasonic sensor eliminates inspection blind spots in extreme environments

The Korea Research Institute of Standards and Science (KRISS, President Lee Ho-seong) has developed an ultrasonic sensor technology that applies a waveguide to detect defects in all directions without ...
Semiconductor Engineering

3D Atomic-Scale Metrology of Strain Relaxation And Roughness in GAAFETs Via Electron Ptychography (Cornell, ASM, TSMC)

A new technical paper, “3D atomic-scale metrology of strain relaxation and roughness in Gate-All-Around transistors via ...
Semiconductor Engineering

Surface Metrology for Hybrid Bonding in Advanced Semiconductor Packaging

Achieving a reliable hybrid bond requires both surfaces to be pristine. To support this requirement, metrology methods such as atomic force microscopy (AFM) and atomic force profilometry (AFP) are ...