Embedded systems power the modern world—quietly running inside vehicles, medical devices, industrial controllers, routers, ...

Ahead of Display Week 2025, CEO Robert Ramsey, Ph.D., and Chief Scientist Michael Robinson, Ph.D., of Rain Technology today shared domain expert commentary and video explainers about the future for ...

The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...

SAN FRANCISCO — Intel gave further details on its technique for embedding spin-transfer torque (STT)-MRAM into devices using its 22-nm FinFET process, pronouncing the technology ready for high-volume ...

As the global aerospace and defense industry shifts into the 2020s, embedded systems suppliers are being tasked with supporting certifiable avionics architectures capable of meeting the most stringent ...

Enea Embedded Technology, formerly OSE Systems, has announced version 5.0 of the OSE real-time operating system (RTOS). OSE is a compact, pre-emptive, memory-protected, multi-processor RTOS optimized ...

LONDON, Nov. 13, 2019 /PRNewswire/ -- Telit, a global enabler of the Internet of Things (IoT), today announced Telit simWISE support for 4G LTE-M and NB-IoT connectivity on its first-of-kind cellular ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

It seems a new memory technology is needed to shrink MCUs and SoCs without redesigning the memory system and keep costs in check. It’s expected that, over the next decade, an emerging memory (PCM?

TORONTO--(BUSINESS WIRE)--Walnut, an innovative force in the insurance distribution industry, today announced the successful close of its latest funding round, securing $4.6M. The investment will be ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...